Technology
Nano-Etching & Patterning
A subtractive, direct-write process designed to integrate circuitry onto living substrates with unprecedented resolution.
01. Substrate Engineering
Leveraging natural surface roughness of Reishi mycelium with 0.5 mm PE separation grids.
02. PVD Metallization & Nano-Etching
Application of copper or gold films via Physical Vapor Deposition, adhering naturally to the biological scaffold.
Preserving the Fungal Mind: Traditional semiconductor manufacturing relies on extreme heat and toxic fluorinated gases that would destroy biological tissue. Our protocol utilizes ultrashort pulse (femtosecond) laser ablation to precisely nano-etch conductive pathways (1,000–10,000 nm feature sizes). This direct-write process minimizes the heat-affected zone (HAZ), vaporizing excess metal without causing thermal damage to the underlying biological "wetware." This non-destructive methodology is critical: it allows us to pattern high-precision circuits while keeping the "cellular consciousness" and environmental reactivity of the mycelium entirely intact and functional.
03. Laser Ablation
Ultrashort pulse lasers define conductive pathways without transferring destructive heat.